Part Number Hot Search : 
30C40 PI6C919W FST16 2405D 37BF01 SMC10 P6KE16A TDA460
Product Description
Full Text Search
 

To Download SPP80N03S2L-03 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 SPI80N03S2L-03 SPP80N03S2L-03,SPB80N03S2L-03
OptiMOS(R) Power-Transistor
Feature
* N-Channel
Product Summary VDS RDS(on) max. SMD version ID
P- TO262 -3-1 P- TO263 -3-2
30 2.8 80
P- TO220 -3-1
V m A
* Enhancement mode * Logic Level * Excellent Gate Charge x R DS(on) product (FOM)
* Superior thermal resistance
* 175C operating temperature * Avalanche rated * dv/dt rated
Type SPP80N03S2L-03 SPB80N03S2L-03 SPI80N03S2L-03
Package P- TO220 -3-1 P- TO263 -3-2 P- TO262 -3-1
Ordering Code Q67040-S4248 Q67040-S4259 Q67042-S4078
Marking 2N03L03 2N03L03 2N03L03
Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Symbol Continuous drain current 1)
TC=25C
Value 80 80 320 810 30 6 20 300 -55... +175 55/175/56
Unit A
ID
Pulsed drain current
TC=25C
ID puls EAS EAR dv/dt VGS Ptot T j , Tstg
Avalanche energy, single pulse
ID=80 A , V DD=25V, RGS=25
mJ
Repetitive avalanche energy, limited by Tjmax 2) Reverse diode dv/dt
IS=80A, VDS=24V, di/dt=200A/s, T jmax=175C
kV/s V W C
Gate source voltage Power dissipation
TC=25C
Operating and storage temperature IEC climatic category; DIN IEC 68-1
Page 1
2003-05-09
SPI80N03S2L-03 SPP80N03S2L-03,SPB80N03S2L-03 Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB:
@ min. footprint @ 6 cm2 cooling area
3)
Symbol min. RthJC RthJA RthJA -
Values typ. 0.3 max. 0.5 62 62 40
Unit
K/W
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage
V GS=0V, ID=1mA
Symbol min. V(BR)DSS VGS(th) IDSS IGSS RDS(on) RDS(on) 30 1.2
Values typ. 1.6 max. 2
Unit
V
Gate threshold voltage, VGS = V DS
ID=250A
Zero gate voltage drain current
V DS=30V, VGS=0V, Tj=25C V DS=30V, VGS=0V, Tj=125C
A 0.01 1 1 1 100 100 nA m 2.9 2.3 2.3 2 3.8 3.5 3.1 2.8
Gate-source leakage current
V GS=20V, VDS=0V
Drain-source on-state resistance
V GS=4.5V, I D=80A V GS=4.5V, I D=80A, SMD version
Drain-source on-state resistance 4)
V GS=10V, I D=80A V GS=10V, I D=80A, SMD version
1Current limited by bondwire ; with an RthJC = 0.5K/W the chip is able to carry ID= 255A at 25C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Defined by design. Not subject to production test. 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. 4Diagrams are related to straight lead versions Page 2
2003-05-09
SPI80N03S2L-03 SPP80N03S2L-03,SPB80N03S2L-03
Electrical Characteristics Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Gate resistance Turn-on delay time Rise time Turn-off delay time Fall time
Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg
VDD =24V, ID =80A, VGS =0 to 10V VDD =24V, ID =80A
Symbol
Conditions min.
Values typ. 185 6150 2400 540 2.5 11.8 34 99 90 max. -
Unit
gfs Ciss Coss Crss RG td(on) tr td(off) tf
VDS 2*ID *RDS(on)max, ID =80A VGS =0V, VDS =25V, f=1MHz
93 -
S
8180 pF 3190 810 17.7 51 148 135 ns
VDD =15V, VGS =10V, ID =40A, RG =1.1
-
19 57 166 2.9
26 86 220 -
nC
V(plateau) VDD = 24 V , ID =80A
V
Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge ISM VSD trr Qrr
VGS =0V, IF =80A VR =15V, IF =lS , diF /dt=100A/s
IS
TC=25C
-
1 65 87
80 320 1.3 80 108
A
V ns nC
Page 3
2003-05-09
SPI80N03S2L-03 SPP80N03S2L-03,SPB80N03S2L-03 1 Power dissipation Ptot = f (TC) parameter: VGS 4 V
320
SPP80N03S2L-03
2 Drain current ID = f (T C) parameter: VGS 10 V
90
SPP80N03S2L-03
W
A
240
70 60 50
P tot
200
160 40 120 30 80 20 40 10 0
0 0 20 40 60 80
100 120 140 160 C 190
ID
0
20
40
60
80
100 120 140 160 C 190
TC
TC
3 Safe operating area ID = f ( VDS ) parameter : D = 0 , TC = 25 C
10
3 SPP80N03S2L-03
4 Max. transient thermal impedance Z thJC = f (t p) parameter : D = t p/T
10
1 SPP80N03S2L-03
K/W
10
/I
D
0
A
=V D
S
t = 36.0s p
Z thJC
10
-1
ID
10
2
RD
S(o n)
100 s
10
-2
D = 0.50 0.20
1 ms -3
10
0.10 0.05
10
-4
single pulse
0.02 0.01
10
1
10
-1
10
0
10
1
V
10
2
10
-5
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
VDS
Page 4
tp
2003-05-09
SPI80N03S2L-03 SPP80N03S2L-03,SPB80N03S2L-03 5 Typ. output characteristic ID = f (V DS); T j=25C parameter: tp = 80 s
SPP80N03S2L-03
6 Typ. drain-source on resistance RDS(on) = f (I D) parameter: VGS
SPP80N03S2L-03
190
Ptot = 300W
i h gf
VGS [V] a b 2.5 2.8 3.0 3.3 3.5 3.8 4.0 4.5 10.0
11
A
160 140
e
m
d e
9
c d
R DS(on)
8 7 6 5 4
f g h i
ID
120 100 80 60
c d
e f g h i
3 2
b VGS [V] =
40 20
a
1 0 0.5 1 1.5 2 2.5 3 3.5 4
d 3.3
e f 3.5 3.8
g 4.0
h i 4.5 10.0
0
V
5
0
0
20
40
60
80
100
120
A
160
VDS
ID
7 Typ. transfer characteristics ID= f ( V GS ); V DS 2 x ID x RDS(on)max parameter: tp = 80 s
320
8 Typ. forward transconductance g fs = f(I D); T j=25C parameter: g fs
250
A
S
200
240 175 200
g fs
150 125 100 75 50 25 0
ID
160
120
80
40
0
0
0.5
1
1.5
2
2.5
3
3.5
4
V5 VGS
0
20
40
60
80 100 120 140 160
A 200 ID
Page 5
2003-05-09
SPI80N03S2L-03 SPP80N03S2L-03,SPB80N03S2L-03 9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 80 A, VGS = 10 V
SPP80N03S2L-03
10 Typ. gate threshold voltage VGS(th) = f (T j) parameter: VGS = VDS
2
m
7.5
1.25 mA
6
V V GS(th)
250 A
R DS(on)
5.5 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 -60 -20 20 60 100 140 C 200 typ 98%
1
0.5
0 -60
-20
20
60
100
C Tj
180
Tj
11 Typ. capacitances C = f (V DS) parameter: VGS=0V, f=1 MHz
10
5
12 Forward character. of reverse diode IF = f (V SD) parameter: T j , tp = 80 s
10
3 SPP80N03S2L-03
pF
A
10
4
C oss
10
3
IF
10
1
C
C iss
10
2
C rss
T j = 25 C typ T j = 175 C typ T j = 25 C (98%) T j = 175 C (98%) 10
2
10 5 10 15 20
0
0
V
30
0
0.4
0.8
1.2
1.6
2
2.4 V
3
V DS
VSD
Page 6
2003-05-09
SPI80N03S2L-03 SPP80N03S2L-03,SPB80N03S2L-03 13 Typ. avalanche energy E AS = f (T j) par.: I D = 80 A , V DD = 25 V, R GS = 25
850
14 Typ. gate charge VGS = f (QGate) parameter: ID = 80 A pulsed
16
SPP80N03S2L-03
mJ
V
700 12 600
E AS
VGS
10 0,2 VDS max 8 0,8 VDS max
500 400 300
6
200 100 0 25
4
2
45
65
85
105
125
145
C 185 Tj
0 0 40 80 120 160 200 nC 260
QGate
15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: ID=10 mA
36
SPP80N03S2L-03
V
V(BR)DSS
34 33 32 31 30 29 28 27 -60
-20
20
60
100
140 C
200
Tj
Page 7
2003-05-09
SPI80N03S2L-03 SPP80N03S2L-03,SPB80N03S2L-03
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Further information Please notice that the part number is BSPP80N03S2L-03, BSPB80N03S2L-03 and BSPI80N03S2L-03, for simplicity the device is referred to by the term SPP80N03S2L-03, SPB80N03S2L-03 and SPI80N03S2L-03 throughout this documentation
Page 8
2003-05-09


▲Up To Search▲   

 
Price & Availability of SPP80N03S2L-03

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X